Laser Drilling Machines
Mitsubishi Electric takes laser drilling machines to a whole new level.
Key components such as laser oscillators, galvano scanners, f-theta lenses and control devices are all originally developed and manufactured by Mitsubishi Electric thanks to its comprehensiveness as a leading laser processing machine and factory automation equipment manufacturer, promising high product quality and reliable service.
Numerous honorable awards are granted for Mitsubishi Electric original technology and outstanding performance record.
Enquiry about Laser Drilling Machines
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Laser Drilling Machines
Our laser drilling machines are used to drill tiny thru-holes in electronic circuit boards at very high speeds. It supports high-density packaging of various electronic devices, such as smartphones, tablets and computers.
GTW5 series
Feature
Advanced 2-beam-2-panel model sets the global standard for laser drilling machines
■All-round capability model
Full fθ lens lineup for this model enables its application to wide ranging processing contents from copper direct and resin direct to small diameter processing.
■Industry’s top-level productivity
New control method “Synchrom” technology equipped as standard function achieves overwhelming productivity, stable processing quality and high positioning accuracy.
■Small diameter drilling acclaimed over world
Mitsubishi Electric original optical technology realizes drilling of 40μm diameter or less, which has been considered too challenging at CO2 laser.
GTF4 Series
4-beam-2-panel model
Package substrate drilling machine
Targeting at package substrate processing, this 4-beam machine realizes high productivity, stable quality and accurate positioning.
Overwhelming productivity
Mitsubishi Electric’s original optics for simultaneous 4-beam drilling and “5350UM “, laser oscillator exclusive for package substrate processing, achieve the industry’s top-class productivity.
High positioning accuracy
The newly developed galvano scanner “2700GL2” and ultra rigid machine frame realize extremely high positioning accuracy.
GTW5-UVF20 Series
2-beam-2-panel model
Flexible substrate drilling machine
The “UV laser oscillator” with a laser wavelength of 355nm, suited for the processing of Polyimide which is the main material of flexible substrates, realizes consistent processing quality.
High speed trepanning
Mitsubishi Electric’s original galvano scanner, newly developed control technology “Synchrom” and high speed UV laser oscillator help bring higher productivity with consistent quality.
Stable mass-production
Equipped with a Reel-to-Reel (RtoR) sheet transfer device applicable to 250/260mm wide sheets. Delivers stable high-volume production on rolled materials.
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